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Home » Data Center Liquid Cooling Experts Colovore and ZutaCore Embody Strategic AI Alliance Trend
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Data Center Liquid Cooling Experts Colovore and ZutaCore Embody Strategic AI Alliance Trend

i2wtcBy i2wtcMay 29, 2024No Comments5 Mins Read
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Terms of the transaction were not disclosed. DH Capital, a division of Citizens, acted as exclusive financial advisor to Colovore.

Kirkland & Ellis LLP served as legal counsel to King Street, a global alternative investment firm founded in 1995 that manages more than $25 billion in assets across public and private markets.

Mark Van Zandt, Co-Head of Real Estate at King Street, concluded: “King Street’s Data Centre Investment Platform is an extension of our thematic approach to global real estate investments. Working closely with our colleagues in the technology and energy sectors, we bring a comprehensive and differentiated view to the data centre industry and look forward to working with CoroBore to capitalise on this rapidly evolving investment opportunity.”

UNICOM and ZutaCore Sign Strategic OEM Agreement to Bring Cool AI Servers to the World

Meanwhile, ZutaCore, a provider of direct-to-chip waterless liquid cooling technology, announced a strategic partnership with UNICOM Engineering on May 13.

UNICOM Engineering, a Dell Titanium OEM partner and systems integrator, provides server-based application platforms and lifecycle support services to software technology developers, data center infrastructure, OEMs and enterprises worldwide, highlighting the global reach and impact of the collaboration.

This new partnership begins with Dell’s XE9680 platform featuring NVIDIA H100 and H200 GPUs, marking a significant milestone in incorporating ZutaCore’s HyperCool technology into Dell Technologies servers worldwide, ensuring global enterprise support and warranty for large-scale data centers.

“This partnership marks an important milestone in bringing ZutaCore’s waterless direct-to-chip liquid cooling to market on a global scale,” said Erez Freibach, co-founder and CEO of ZutaCore. “The future of AI depends on the ability to deliver next-generation GPU performance while adhering to strong sustainable practices within the data center.”

Freibach continued: “ZutaCore is unique from other cooling solutions in that it can cool the hottest processors without water and with little to no effort on your current real estate, power or cooling systems.”

At the same time, ZutaCore announced that an unnamed “global AIaaS (Artificial Intelligence as a Service) provider/leader” had selected ZutaCore-powered Dell Technologies XE9680 servers as the central platform for launching its AI services.

This groundbreaking selection highlights the exceptional efficiency and reliability of ZutaCore’s HyperCool technology, especially for the high-density computing needs required for AI workloads.

According to the partners, the AIaaS provider plans to begin production deployments starting in the third quarter of 2024 and is expected to set a new standard in AI computing in terms of performance and sustainability.

In March, ZutaCore’s HyperCool technology was named one of the featured products at the NVIDIA GTC 2024 event. The company said the technology has been proven to cool over 2,800 watts of processors and can now support 120 kW of computing power per rack, as well as increase rack processing density by 300%.

ZutaCore claims that its HyperCool brand is the only two-phase direct chip dielectric cooling solution currently deployed in production, and a growing number of servers are certified to run HyperCool technology, including ASUS, Pegatron, SuperMicro, and Dell Technologies.

With a unique closed-loop system that operates at low pressure and removes large amounts of heat from processors and servers, ZutaCore claims that implementing its HyperCool platform in new or existing data centers can increase computing power by 10 times and reduce total cost of ownership by 50%, while also reusing 100% of heat and reducing CO2 emissions for sustainability.

Founded in 1997, UNICOM Engineering is headquartered in Canton, Massachusetts, with offices in Plano, Texas, Galway, Ireland, and Manila, Philippines.

Rusty Cone, general manager at UNICOM, said: “By leveraging UNICOM Engineering’s technical expertise, global footprint and established relationships with leading silicon manufacturers and server OEMs, notably Dell Technologies, our data center clients and partners can be confident that the highest standards are met in the integration of ZutaCore HyperCool technology. This, plus full global warranty and enhanced services, ensures a sustainable AI infrastructure capable of supporting a wide range of applications that require the most demanding workloads and processing power.”

ZutaCore Delivers Direct-to-Chip Liquid Cooling for NVIDIA’s GB200 Grace Blackwell Superchip

As mentioned above, and as company executives said in a recent episode of the DCF Show Podcast, ZutaCore established its role as NVIDIA’s primary AI liquid cooling partner at the NVIDIA GTC 2024 event this spring.

Fast forward to this month’s Dell Technologies World 2024 (May 20-23), and ZutaCore has unveiled the first waterless direct-to-chip liquid cooling cold plate for NVIDIA’s GB200 Grace Blackwell superchip.

With a single monolithic cold plate, ZutaCore’s HyperCool support for Blackwell superchips enables hyperscalers to harness the massive processing power of the world’s most powerful AI GPUs in a sustainable and cost-effective manner.

At Dell Technologies World, ZutaCore again showed off its dielectric cold plates supporting the new Blackwell platform, with, as the company puts it, “an unprecedented capacity to cool 120 kW of rack power with little to no changes to your current real estate, power, or cooling systems.”

“ZutaCore’s breakthrough technology enables the NVIDIA GB200 superchip to be cooled by a single cold plate, delivering the industry’s first waterless direct-to-chip liquid cooling solution,” said Freibach, CEO of ZutaCore. “This breakthrough technology frees AI data center owners and operators from the risks associated with water-based cooling, enabling them to deploy the processing power required for compute-intensive workloads like generative AI without worrying about leaks.”



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