Broadcom expects to sell 1 million 3D stacked chips by 2027
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Broadcom expects to sell a significant number of 3D stacked chips by 2027, with reports suggesting a target of at least 1 million units. The company's goal for 3D stacked chip sales has been noted in recent reports and analyses. The target is mentioned in the context of broader discussions about the company's performance and the chip industry.
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