SK hynix has unveiled a cooling-integrated high-bandwidth memory (HBM) solution, referred to as "iHBM" in some reports, which is designed to boost AI performance. The technology, which utilizes "ICE" tech, is said to reduce memory thermals, with one report suggesting it can cut HBM heat by over 30%. The development may be part of a larger trend, as other companies, such as Samsung, are also working on similar cooling technologies for HBM products.