SK hynix unveils cooling technology to cut HBM heat by over 30%
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SK hynix has unveiled a cooling technology to reduce heat in high bandwidth memory (HBM) by over 30%. The technology, referred to as "iHBM", is said to integrate cooling and boost ai performance. Details of the technology, including its specific components such as "ICE" tech, are emerging, with reports suggesting it will be used in next-gen HBM products.
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